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JOB ID 20597
Process Engineering Manager (Wirebond/Die Attach)

locationLocation

Perak

businessBusiness

Computer/Information Technology

salarySalary

13,000-15,000 (RM)

JOB DETAILJob Details

- Responsible for overall process engineering support from yield, scrap cost, design for manufacturability, process standardization and process simplification

- Managing the teams, arrange coverage when there is need to ensure no disruption to productivity

- Early involvement for new product introduction and process development during EVT stage

- Working with tooling, automation team and external vendor for jigs, tools design in supporting new process requirement

- Timely respond to line issues to ensure smooth manufacturing flow

- Guiding engineers to actively in Lean Manufacturing projects and cost reduction projects


-Set and review quarterly KPI with respective engineers

REQUIRED WORK EXPERIENCERequired

- Bachelor in Mechanical / Mechatronic / Electrical & Electronics Engineering

- Experience working in high mix and high volume manufacturing environment in semiconductor assy processes will be an added advantage

- Minimum of 7 years of experience in managing a team of engineers & technicians

- Must exhibit a strong sense of analytical skills, good observer and hands on

- Adaptable and flexible to rapid changes to the business needs of the company

- Good knowledge of mechanical dimensioning & tolerancing analysis, poka-yoke principles will be an added advantage

- Experience in Wirebond and Die Attach process is preferred.

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